Preparation and application of 5G mobile phone Soft compression high thermal conductivity insulating silicon gel

Solving the bottleneck problem of 5G device heat dissipation, the thermal conductivity of the product can reach 8.0W/m · K or above

Soft and highly compressible, suitable for applications in various design spaces.

High viscosity effectively reduces contact thermal resistance and ensures the service life of electronic products.

Extremely low compression reaction force, will not damage core components such as chips.

No residue stripping is required for reprocessing, which can greatly save production costs and improve efficiency.