According to the types of thermal conductive silicone gaskets, they are divided into conventional thermal conductive silicone gaskets and low volatility thermal conductive silicone gaskets. Their thermal conductivity coefficients are as follows:

Conventional thermal conductive silicone gasket: 1.5~10W/m.K or above

Low volatility thermal conductive silicone gasket: 2.5~10W/m.K

Because highly viscous and resilient thermal pads require the addition of adhesive and fiberglass during the production process. The thermal resistance between glue and fiberglass itself is relatively high, so its thermal conductivity is also average.

In addition, there is also a thermal resistance issue to consider: the thinner the thickness of the silicone pad layer, the smaller the thermal resistance. The reason is that the surface temperature of the silicone thermal conductive element is higher, and the longer it takes for the surface temperature of the thermal conductive element to transfer from one end of the thermal conductive silicone pad to the other, the slower the heat transfer rate. Therefore, when designing the heat dissipation scheme for customers' products, we generally recommend minimizing the heat transfer distance as much as possible, so that customers' products can achieve a win-win situation in terms of both heat conduction effect and cost.