Thermal HF2200 Thermal phase change material is a new type of material, which is composed of nanometer high thermal conductivity material and phase change compound and coated on both sides of thermal PI film. It is specially applied to the heat transfer interface of power consumption device and radiator. Thermal HF2200 at 52℃, the phase change from solid phase to liquid phase. So as to ensure that the surface of the power consumption device and the radiator is fully wetted, to produce the lowest thermal resistance and to form a good heat conduction channel. The radiator can achieve the best heat dissipation performance, thus enhancing the reliability of power devices.
