FHD-F301
Thermal Conductive Material Series-Thermal Grease

FHD-F301 Thermal greases offer a range of performance covering the simplest to the most demanding thermal requirements. These materials are screened, stenciled or dispensed and require virtually no compressive force to conform under typical assembly pressures.

Product Introduction

FHD-F301 Thermal greases offer a range of performance covering the simplest to the most demanding thermal requirements. These materials are screened, stenciled or dispensed and require virtually no compressive force to conform under typical assembly pressures. They are excellent for conforming to surface micro-voids created by machining/casting to reduce thermal impedance.Thermal greases have excellent surface wetting characteristics and flow easily to fill voids at the interfaces resulting in low thermal impedance even at low pressure.

Typical applications

Features and advantages

Low thermal impedance, great surface wetting Ideal for rework and field repair situations Fills interface variable tolerances in electronics assemblies and heat sink applications Supports high power applications requiring material with minimum bond line thickness Silicone based materials conduct heat between a hot component and a heat sink or enclosure Thermally stable and require virtually no compressive force to deform under typical assembly pressures
Contact information
Company address
Floor 12, Building 3A, Huaqiang Creative Industrial Park, Guangguang Road, Guangming District, Shenzhen
Business email
marketing@fhdkj.cn