FHD-HP2000 is a two-component liquid gap filling material, cured at either room or elevated temperature, featuring ultra-high thermal performance and superior softness. Prior to curing, the material maintains good thixotropic characteristics as well as low viscosity.
The result is a gel-like liquid material designed to fill air gaps and voids yet flow when acted upon by an external force (e.g.dispensing or assembly process). The material is an excellent solution for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing.
