The thermal resistance of air is relatively high, and other materials must be used to reduce its thermal resistance, otherwise its performance will decrease and even fail to function properly. The thermal conductive medium is generated, which fills the size gap between the processor and the heat sink, increasing the contact area between the heat source and the heat sink. So, heat conduction is only the function of the heat transfer medium, and increasing the effective contact area between the CPU and the heat sink is crucial. Like thermal grease, thermal silicone is made by adding some chemical raw materials to silicone oil and then undergoing chemical treatment. But unlike thermal silicone grease, the chemical raw materials it adds contain some viscous substances, so the final product of thermal silicone has a certain adhesive strength.

The biggest characteristic of thermal conductive adhesive is its hard texture, and its solidified thermal conductive material is lower than that of thermal conductive resin. Currently, there are two main types of thermal conductive silicone on the market: one is a white solid with a deep coating, and the other is an inner color solid with a glossy finish. Ordinary silicone manufacturers are accustomed to using the first type of silicone as the adhesive between the radiator and heater. Its advantage is strong viscosity, but this is precisely its disadvantage. When maintenance is needed, it is common to find a large amount of solid white silicone residue on the contact surface between the adhered components and the heat sink, which is difficult to clean thoroughly.

Compared to the former, the second type of silicone has more obvious advantages: on the one hand, its heat dissipation rate is higher, and on the other hand, the black body formed after solidification is more brittle, and the residue is easy to remove. Anyway, thermal conductivity: Silicone has low thermal conductivity efficiency and is prone to sticking devices and heat sinks, so unless there are special circumstances, it is recommended that users use it.

Due to the fact that the thermal conductive medium is an important component of the heat sink, in order to fully utilize the function of foam copper heat dissipation, it is necessary to use thermal conductive media such as silicone gel or silicone grease to connect the CPU and heat dissipation. At the connection between the CPU and the heat sink, many invisible gaps are filled with air with poor thermal conductivity, so it is necessary to fill these spaces.