Switches and chips generate a large amount of heat during operation, and high temperatures may affect the performance and product stability of switch chips. In order to dissipate the heat generated by the chip in a timely manner, we can use Feihongda low volatility thermal conductive silicon film, which can effectively fill the gap between the surface of the heat source and the contact surface of the heat sink, thereby reducing the thermal resistance between the heat source and the heat sink and achieving rapid heat dissipation.
Our thermal conductivity silicone film can be customized from 1.5 to 15.0W, which can meet the vast majority of heat dissipation needs.
