With the rapid development of 5G communication, the market penetration rate of 5G small base stations is also increasing. Due to the limitations of miniaturization, the density and complexity of electronic components in base stations are constantly increasing. To ensure the reliable operation of electronic devices, we can use Feihongda conductive adhesive at the joint of the shell, which has strong surface adhesion and good shielding effect, and can achieve electromagnetic compatibility or electromagnetic shielding.
At some of the main heating chips inside, we can add Feihongda thermal gel or thermal pad to help heat dissipation and improve the overall reliability.
The thermal conductivity of our two-component thermal conductive gel can reach 8W silicone film 15W, which can meet most heat dissipation requirements.
