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How can thermal grease be replaced correctly?

Due to the central position of the computer, the heat generated by the CPU is astonishing. Ordinary CPU transfer heat energy to the heat sink through thermal grease to achieve heat dissipation. Over time, when the CPU generates too much heat, the system may experience blue screens, crashes, restarts, and other issues. Replacing the heat dissipating silicone grease can effectively solve this problem.

What is the service life of thermal conductive silicone film?

With the continuous development of science and technology, there are a wide variety of materials used in electronic products, and their applications are also very extensive. Among them, thermal conductive silicone sheet is a filling material with strong thermal conductivity and good physical inertness, which will not cause short circuits in the circuit board.

Types of Thermal Conductive Silicone Gaskets

According to the type of thermal conductive silicone gasket, it can be divided into conventional thermal conductive silicone gasket and low volatility thermal conductive silicone gasket.

The difference between CPU thermal grease and silicone thermal film

Thermal conductive silicone grease is inconvenient to use and can be replaced with thermal conductive silicone pads. It is recommended to use thermal grease for general desktop computer CPU because we disassemble and assemble them more frequently than hardware.

Heating curing sealant at room temperature

Polyurethane sealant is a type of sealant that falls between epoxy resin sealant and silicone resin sealant. Its high temperature resistance is not outstanding, on the contrary, it has good low temperature resistance.

Is the operation of insulation sealant simple?

The introduction of thermal insulation sealant is to further meet some special requirements of the electrical and electronic manufacturing industry for sealant. Due to the wide variety and scope of products used in sealant applications, different sealants often have different application areas.
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