Thermal conductive materials of VR equipment mainly include thermal conductive silica gel sheet, thermal conductive gel and phase change materials, which are used to efficiently transmit the heat of CPU, chip and other heating parts to the heat dissipation device.
Thermal conductive silicone sheet
Thermal conductive silicone sheet has high thermal conductivity and flexibility, which can fill the gap between the heat source and the heat sink, achieving rapid thermal conductivity. Its material is lightweight and has a wide temperature resistance range, suitable for the heat dissipation needs of high-power components in VR devices.
Thermal gel
Thermal gel is mainly made of silicon based materials. It is light, thin and stress free. It can directly contact the core components such as CPU, and improve the heat dissipation efficiency by filling gaps. Its advantage lies in its convenient operation and compatibility with multiple heat dissipation designs.
Phase change materials
Non silicon phase change materials absorb heat through a solid to liquid phase transition process, and have low volatility and no oil release characteristics, making them suitable for VR devices that are sensitive to the environment. This material can maintain stable thermal conductivity even in high temperature environments, extending the heat dissipation cycle.
