The issue of heat dissipation is a crucial technical problem for laptops. The emission of heat is related to the stability of the entire system and the service life of the product. According to statistics, 80% of computer hardware failures are caused by "temperature". Effective heat dissipation is of great significance, especially for laptops and some small mobile terminal products.
The composition principle of the computer CPU cooling module is as follows:
(1) When the CPU is working, the heat generated is transferred to the heat dissipation board;
(2) The heat transferred from the heat dissipation plate is quickly transferred to the fan outlet through the heat dissipation pipe;
(3) A cooling fan utilizes the principle of air convection to dissipate heat to the outside of the host.
Thermal interface material
Thermal interface materials (TIMs) are widely used in the field of electronic component heat dissipation, playing a crucial role in computer heat dissipation. Its main function is to fill between the chip and the heat sink, as well as between the heat sink and the heat sink, to expel the air inside (air is a poor conductor of heat with a thermal conductivity of only 0.025W/m · K), so that the heat generated by the chip can be more quickly transferred to the outside through the thermal interface material, achieving the important role of reducing operating temperature and extending service life.
Thermal pad
Thermal conductivity: 2-3.5w
Model: F200S-B61, F250D-B60, F300D-B60, F350D-B60
Thermal grease
Thermal conductivity: 5-6w
Model: F301, TG500, TG600
Thermal gel
Thermal conductivity: 6w
Model: Thermal TG6500
