The heat dissipation of 5G smartphones faces two main challenges: On one hand, the power consumption is increasing, resulting in higher heat generation. On the other hand, the external design of 5G smartphones further complicates heat dissipation. For example, the increasingly slim size limits the space available for heat dissipation materials; while ceramic and glass materials are aesthetically pleasing, they offer poor heat dissipation; the curved surface design also reduces the heat dissipation area. Therefore, given these challenges, finding suitable heat dissipation materials is crucial for developing an effective thermal management solution.
The smartphone heat dissipation system consists of three components: heat spreading devices (such as heat dissipation films), thermal interface materials, and heat sink devices. These components typically appear in various combinations within the phone. The heat spreading devices are primarily heat dissipation films made of high thermal conductivity materials like graphite and copper plates. They rapidly spread the heat generated in localized areas to a larger surface for cooling, thereby quickly and effectively alleviating localized overheating issues in the smartphone.
Thermal interface materials are used to fill the gaps between interfaces, establishing a bridge for heat transfer between the heat source and various thermal management components. Common thermal interface materials used in smartphones include thermal grease, thermal pads, thermal gels, and thermal phase change materials. Heat spreading devices typically use heat pipes or vapor chambers (VC), which are filled with water or other highly conductive liquids. Through the circulation and phase change of the liquid, these devices enable the effective transfer and dissipation of heat inside the smartphone.
