As tablet performance improves, components such as processors and GPU generate significant heat during operation. Traditional heat dissipation technologies, such as heat sinks and fans, are limited by the compact internal space of devices and difficult to effectively dissipate heat. Thermal conductive materials help distribute heat from core components to a wider area and maintain equipment temperature balance by optimizing the heat conduction path.
Thermal gel
By directly coating or filling the surface of the heating component, the thermal gel can realize close contact heat conduction and effectively reduce the core temperature. This material has strong weather resistance and is suitable for high temperature and humid environments, significantly improving battery life and equipment reliability.
Thermal pad
The main function of the thermal conductive silicone sheet in the flat plate is to fill the internal gaps of the device, quickly conduct heat from the core components to the heat sink or shell, and effectively reduce the device temperature. In addition, the thermal conductive silicone sheet can effectively reduce the thermal resistance inside the equipment and improve the overall heat dissipation efficiency. By using thermal conductive silicone sheets, tablet devices can maintain a stable temperature even during high load tasks, avoiding performance degradation or damage caused by overheating.
Thermal grease
The application of thermal conductive silicone grease in tablet devices mainly involves filling the micro gaps between components and heat dissipation components, improving thermal conductivity efficiency, and ensuring stable operation of the equipment. Thermal conductive silicone grease fills the air gap between heat sources and heat dissipation components such as CPUs and power modules, forming a continuous thermal conductive path and reducing interface thermal resistance. For example, filling the gap between IGBT modules and heat sinks in a flat panel to avoid component failure caused by local high temperatures.
